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QDOS
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    • Flex Printed Circuits Board (FPC)
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Process

Flexible Printed Circuit Board (FPC)
Molded Interconnect Substrate (MIS)
Flexible Printed Circuit Board (FPC)

Molded Interconnect Substrate (MIS)

  • Apply (Semi-Additive-Process) SAP Technology
  • To Achieve 20um Fine Line & Air Gap Capability

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