We have launched a new product family, Molded Interconnect Substrate (MIS) after twenty years of excellence in FPC design and manufacturing. MIS technology redefines coreless IC substrates.
MIS is a new technology with huge potential to replace Lead Frame and BGA Substrate. The use of build-up technology and a breakthrough from the conventional polymer core enables MIS technology to produce super fine circuitry and to enable high performance applications, particularly those with 4G, low noise and high frequency requirements. MIS technology redefines coreless IC substrates. This cutting-edge technology provides an innovative solution to BGA, QFN, WB and fine pitch FC semiconductor packaging.